Low-Temperature Hot Melt Adhesives

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Low-Temperature Hot Melt Adhesives

Low-temp adhesives are designed to melt and bond at lower temperatures, reducing energy consumption and protecting heat-sensitive materials like foam and delicate plastics.

  • Lower melting point
  • Safer for operators and delicate materials
  • Quick setup
  • Reduced carbon footprint

• Foam packaging • Electronics assembly • Temperature-sensitive plastics • Arts and crafts

Product Property & Details

Property Details
Base Material: EVA, APAO
Viscosity: 1,200 – 4,000 cps at 135°C
Application Temp.: 120°C – 140°C
Open Time: 10 – 40 seconds
Set Time: 5 – 15 seconds
Softening Point: 70°C – 90°C
Bond Strength: Moderate
Color: Clear or white
Form: Sticks, pellets
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