Low-Temperature Hot Melt Adhesives
Low-Temperature Hot Melt Adhesives
Low-temp adhesives are designed to melt and bond at lower temperatures, reducing energy consumption and protecting heat-sensitive materials like foam and delicate plastics.
- Lower melting point
- Safer for operators and delicate materials
- Quick setup
- Reduced carbon footprint
• Foam packaging
• Electronics assembly
• Temperature-sensitive plastics
• Arts and crafts
Product Property & Details
Property | Details |
---|---|
Base Material: | EVA, APAO |
Viscosity: | 1,200 – 4,000 cps at 135°C |
Application Temp.: | 120°C – 140°C |
Open Time: | 10 – 40 seconds |
Set Time: | 5 – 15 seconds |
Softening Point: | 70°C – 90°C |
Bond Strength: | Moderate |
Color: | Clear or white |
Form: | Sticks, pellets |